Presentation
Specifying Rack Level High Density Liquid Cooling Solutions
Presenter
Event Type
Exhibitor Forum
HPC Center Planning and Operations
TimeWednesday, November 14th4pm - 4:30pm
LocationD173
DescriptionThe higher the density of heat generating equipment, the higher the risk of any failure resulting from inadequate rack, row and room level cooling. Presenting rack level cooling design considerations and methods for managing high heat loads in HPC applications. Passive or active rear door solutions offer an efficient way of cooling up to 45kW per rack. Whereas, the hot exhaust air from the rack-mounted equipment passes through a passive door mounted cooling coil and water circuit – an integrated fan assembly delivers additional CFM in active cooling configurations. When optimizing the heat transfer, the coil layout and optimized air/water circuit temperatures can improve cooling performance. Some HPC configurations can generate even higher heat loads and may require high-density liquid-to-liquid cooling as an ideal alternative – both chip and system level. Additionally, it is essential to deploy reliable monitoring of working parameters as well as leak detection along the pipework.
Presenter